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Electronics & Semiconductor Manufacturing
Fabs, equipment, OSAT, PCB/SMT, EMS, and cleanroom facility ecosystems.
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Latest in Electronics & Semiconductor Manufacturing
Ball to build new can-manufacturing plant in India – BizWest
4+ hour, 34+ min ago (169+ words) WESTMINSTER — Ball Corp. (NYSE: BALL) is building a new beverage can manufacturing facility in Uttar Pradesh, India. The company, which operates two existing plants in the country, expects to open the Uttar Pradesh factory in 2029. “Our vision is to build…...
Amazon says switch from plastic to paper makes e-commerce more sustainable
3+ hour, 15+ min ago (165+ words) Retailer has developed a new type of “extensible paper” to replace plastic packaging in its U.S. e-commerce operations. E-commerce and logistics giant Amazon says it has developed a “stronger, stretchier kind of paper” used for shipping parcels, saying the…...
Target extends packaging recyclability goal to 2035
7+ hour, 21+ min ago (428+ words) The retailer has had a hard time moving the needle on PCR use, but has gained some traction with lightweighting and refill efforts, per its 2026 sustainability and governance report. Target now aims to make all of its owned brand packaging…...
APCO Platform for next phase of packaging reform in Australia
19+ hour, 59+ min ago (395+ words) The settings have been developed over the past year with its members and government, and they set out what needs to happen and what will work in practice. The Platform follows the Australian Government’s recent decision not to introduce a…...
Swansea Firm Reaches Sustainability Milestone with Compostable Packaging
22+ hour, 56+ min ago (538+ words) Swansea-based packaging manufacturer and distributor Viscose Closures has achieved OK compost HOME certification from TÜV AUSTRIA for its transparent Plastic-free shrink sleeves, including printed transparent sleeves. The certification marks a significant milestone for the business, providing independent verification that the…...
CPO Design Evolution Drives Gen Precision's Expansion of Custom FAU Inspection for Production Lines
16+ hour, 28+ min ago (170+ words) Gen Precision expands the GTK-OSI1 for production-line inspection of FAUs with up to 80 channels and custom structures, delivering 3σ ≤ 0.1 μm repeatability. Gen Precision has completed inspection and validation projects for multiple customers, including non-standard custom designs, and has shipped its first…...
South Korean Startup Nanu Doubles Revenue with Custom Coatings That Overcome Paper Packaging Limits — BigGo Finance
20+ hour, 51+ min ago (447+ words) South Korean eco-friendly packaging startup Nanu is growing rapidly by solving the water, oil, and heat resistance limitations of paper containers with its proprietary water-soluble coating technology. Founded in 2021, the company received separable disposal labeling approval for paper in March…...
India Semiconductor Sector Funding: Why Bengaluru Leads
22+ hour, 15+ min ago (928+ words) The figures come as India prepares to host the fifth edition of SEMICON India from September 17 to 19 at Yashobhoomi in Dwarka, New Delhi. Prime Minister Narendra Modi is scheduled to inaugurate the event on September 17. The gathering is expected to…...
izmo Microsystems Develops 40 GHz RF Package for Defence
22+ hour, 1+ min ago (453+ words) izmo Microsystems Pvt Ltd, the semiconductor subsidiary of IZMO Limited, has developed and manufactured an indigenous high-frequency RF Quad Flat No-Lead (QFN) semiconductor package for devices operating at frequencies of up to 40 GHz. The package has been developed for a…...
Domino features digital retrofit technology at Loupe
1+ day, 5+ hour ago (55+ words) At Loupe Americas 2026, the company runs live equipment demonstrations, Sunrise DFE presentations and label samples. Domino N610i-R digital retrofit module The new WA-669 wash-away adhesive for glass packaging will debut at Loupe Americas 2026. The world of package printing Gain knowledge…...